http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07138201-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecc58e5fd0006c472fea1ec2f879638c |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 |
filingDate | 1993-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4b97244ea59321cc2120040e78b01e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e12331616d01c4a0659d9e839df2f85d |
publicationDate | 1995-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H07138201-A |
titleOfInvention | Monoallylnaphthol compound, curing agent for epoxy resin and epoxy resin composition containing the compound |
abstract | (57) [Summary] [Structure] A naphthol compound having one allyl group represented by the following general formula. [Chemical 1] [Effect] The monoallylnaphthol compound of the present invention can be effectively used as a modifier, modifier, diluent and curing agent for various resins. In particular, when it is used as a modifier for a curing agent for epoxy resins, it not only excels in molding workability, but the resulting cured epoxy resin also has excellent heat resistance, moisture resistance, adhesion and flexibility, and cracks in the package during soldering. Is less likely to occur. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020188641-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020188641-A1 |
priorityDate | 1993-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.