http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07130747-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1993-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d94d582d14430bf9e6ce59ddf34946d1 |
| publicationDate | 1995-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07130747-A |
| titleOfInvention | Bonding device and inspection method |
| abstract | (57) [Abstract] [Purpose] A bonding apparatus for forming a stud bump by thermocompression bonding a ball formed at the tip of a gold wire to an electrode, and a bonding apparatus capable of shortening the time for forming a stud bump on an electrode on a semiconductor chip. For the purpose of providing. In addition to a capillary 32 in which a bonding head of the apparatus guides a gold wire 31 and presses a ball against an electrode 5, a pattern recognition mechanism 2 for recognizing the position of the electrode 5 at least prior to the formation of a stud bump 6 and an electrode 5 are provided. A stud recognition mechanism 7 for inspecting the presence or absence of the stud bumps 6 formed above The stud bump 6 is formed in parallel with the inspection. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008186622-A |
| priorityDate | 1993-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 |
Total number of triples: 19.