http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0712893-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0433
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
filingDate 1994-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8abc957bc6086a3f013d1622832779f5
publicationDate 1995-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0712893-A
titleOfInvention Method and apparatus for coupling semiconductor devices to test equipment
abstract (57) [Summary] [Purpose] To enable testing of semiconductor devices encapsulated before leads are molded. [Structure] A method for producing and using a test fixture (10) for testing a packaged semiconductor device (44). The test fixture (10) includes a non-conductive housing (11) and a contactor assembly (30). The contactor assembly has contactor leads (31) and is removable from the housing. The contactor assembly is mounted on the housing and the contactor leads have an upper cantilever structure (2 0) and the lower cantilever structure (21) are interdigitated. The test fixture (10) is located between the first tool set (41) and the second tool set (42) of the trim and molding device (40) and the test device (4). 6). Packaged semiconductor devices (44) Are placed and tested in contact with the test fixture (10).
priorityDate 1993-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7028
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419533693

Total number of triples: 16.