| abstract |
(57) [Abstract] [Purpose] The present invention provides a good pattern shape which does not cause a problem in an etching process at a resolution limit of 0.30 μm or less, It is an object of the present invention to provide a practical resist composition capable of finely adjusting sensitivity. [Structure] Any of the following (i) to (iii), (i) a resin which becomes alkali-soluble by removing a protective group by the action of an acid, (ii) an alkali-soluble resin, and a protective group by the action of an acid. A combination of compounds that become desorbed and become alkali-soluble, (Iii) A combination of an alkali-soluble resin and a compound that crosslinks with the resin by the action of an acid to make the resin sparingly soluble in an alkali, a photosensitive compound that generates an acid upon exposure, and p-vinylpyridine as a sensitivity adjusting agent. A resist composition comprising a polymer or a copolymer and a solvent. |