http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07126346-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 1993-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a535019e19e940ec852df4ca274cef7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_409a675813d354d5b7773aeb5ce53962
publicationDate 1995-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07126346-A
titleOfInvention Low dielectric constant resin composition and laminate for low dielectric constant printed circuit
abstract (57) [Summary] [Structure] The present invention is a low dielectric constant resin composition containing an epoxy resin having a dicyclopentadiene skeleton and a phenol resin having a menthane skeleton, and the low dielectric constant resin composition is applied. A laminate prepreg characterized by being impregnated and dried, and in a laminate for a printed circuit in which a conductive layer is provided on at least one surface of an insulating layer, using the above laminate prepreg as an insulating layer. A laminated board for a low dielectric constant printed circuit characterized by being integrally molded by heating and pressing. The low dielectric constant resin composition of the present invention has a low dielectric constant, It has a low dielectric loss tangent value, and prepreg and printed circuit laminates using it can be manufactured with conventional manufacturing equipment, are easy to process, and have low cost, and are suitable for high-speed and high-frequency circuits. is there.
priorityDate 1993-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.