http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07122673-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f101d084de4edfe92fbade3affe1d832 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate | 1993-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_643e1bdd8ee95e34e64e83bf5bdd60a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048f9f1c21947effab8b9d4111688bc4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c956853b3d8613783f6a5373bec93a30 |
| publicationDate | 1995-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07122673-A |
| titleOfInvention | Sealant for gap between metal wire insertion hole of metal plate and metal wire and structure of gap seal portion between metal wire insertion hole of metal plate and metal wire |
| abstract | (57) [Summary] [Structure] The gap between the peripheral wall portion of one or more through holes 3 penetrating the metal plate 1 in the thickness direction and the metal wire 4 inserted into the through holes 3 should be from room temperature to 250. Elastic modulus at ℃ 10,000 A sealing portion structure which is mainly composed of a thermosetting resin having 100 to 100,000 kg / cm 2 and is sealed with a sealing agent 5 in which an inorganic filler is preferably mixed. [Effect] Since the encapsulant has a specific elasticity, cracks and short-circuiting of metal wires do not occur in the encapsulation even in a cycle test in which the encapsulant is placed in a low temperature and high temperature atmosphere. Also, Since the internal strain due to the difference in thermal contraction and thermal expansion between the lead wire and the sealant material can be sufficiently absorbed, the degree of freedom in the selectivity of the material forming the lead wire is improved. In addition, since the sealing agent has excellent adhesiveness to metal, it is not necessary to form an oxide layer on the metal surface unlike glass, which simplifies the manufacturing process and improves productivity. Furthermore, since the heat treatment (curing) temperature is low, the cost of equipment such as a heat treatment furnace is low. Further, since diffusion of gold plating or the like is small at such a temperature, the order of the manufacturing process is not restricted and the process can be simplified. |
| priorityDate | 1993-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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