http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07111384-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a401fc01d6dfc3769430f5ba962561e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 1993-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75e438abd099c480b7cb08ea761e416c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4453ce48102f4d28a538f56dda3b0ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6340db42bae2809c5a5e29d7a3cf180e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b04cc311398b8b58e1d42b5ca3149808 |
| publicationDate | 1995-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07111384-A |
| titleOfInvention | Circuit board manufacturing method |
| abstract | (57) [Abstract] [Purpose] Manufacturing a double-sided circuit board in which an electrically conductive through hole having a through-hole metal plating layer on the inner wall surface and a through hole with an inner wall surface insulated are mixed. In doing so, the number of times the insulating material layer is etched is small, and a practical and simple manufacturing method is obtained. A first through hole having a through hole metal plating layer on an inner wall surface for electrically connecting metal layers formed on both sides of an insulating layer made of a plastic material to each other, and the metal layers on both sides are mutually connected. A method for manufacturing a circuit board having a second through hole having an insulated inner wall surface that is non-conductive, the method for preventing formation of a conductive polymer layer on the inner wall surface of the second through hole. Alternatively, a pretreatment step of performing a selective pretreatment for removal, a conductivity imparting step of forming a conductive polymer layer on the inner wall surface of the first through hole by oxidative polymerization, and a metal on the surface of the conductive polymer layer. The method includes a plating step of depositing a plating layer and a removing step of exposing the plastic material to the inner wall surface of the second through hole which has been subjected to the pretreatment. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002507660-A |
| priorityDate | 1993-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.