http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07109577-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 1993-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f716caa23bdca8caddb9ae27924784 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_036035260c8f4bf2d06caf0e4e655e66 |
| publicationDate | 1995-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07109577-A |
| titleOfInvention | Electroless copper plating method |
| abstract | (57) [Summary] [Purpose] To provide an electroless copper plating method which is excellent in stability even when used properly for a long period of time. [Structure] An electroless copper plating solution containing copper salt, a reducing agent of copper salt, a complexing agent of copper salt, and a pH adjusting agent as basic components is replenished with the basic components that are consumed in the plating reaction, and for a long time. In the method for electroless copper plating, plating is performed by thoroughly mixing and stirring the above-mentioned replenishment component with an electroless copper plating solution and adding a compound having a silicon component. |
| priorityDate | 1993-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.