http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07107193-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 1989-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1995-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07107193-B2 |
| titleOfInvention | A method for consistently forming an essentially crack-free copper plating layer on a substrate by electroless plating |
| priorityDate | 1988-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.