| abstract |
(57) [Summary] [Purpose] Using a maleimide resin with excellent heat resistance, Provided is a highly reliable resin composition for semiconductor encapsulation, which has good fluidity at the time of molding, is excellent in curing characteristics, has a low flexural modulus of a cured molded product, and has small thermal stress. [Structure] 2 to 20% by weight of a polymaleimide compound, 2 to 15% by weight of an allylphenol compound having two or more allyl groups in a molecule, and 0.5 to 10% by weight of a modified polysiloxane compound represented by a specific structural formula. %, And a resin composition for semiconductor encapsulation containing 25 to 95% by weight of silica particles. |