http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0688010-A

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filingDate 1991-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2763fa2e3dfc9aad512555fb34417169
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publicationDate 1994-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0688010-A
titleOfInvention Liquid curing agent composition for resorcinol resin adhesive
abstract (57) [Summary] [Purpose] Since liquid curing agents for conventional resorcinol-based resin adhesives have curing inhibition, etc., they become more pronounced at lower curing temperatures. Although it is necessary to avoid it, when using a liquid curing agent in the winter when the temperature is low, it is necessary to sufficiently perform a bonding operation such as heat retention in order to prevent a bonding failure and to increase the curing temperature. [Constitution] Phenol-formaldehyde condensation resin solution 1 A liquid curing agent composition for resorcinol-based resin adhesive, which comprises 00 parts by weight and 20 to 100 parts by weight of paraformaldehyde or urotropin. [Effect] It is possible to prevent the inhibition of curing, the prolongation of the pressing time and the deterioration of the adhesive performance, and the excellent low-temperature curability is achieved without lowering the productivity of the laminated material or the like.
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