| abstract |
(57) [Summary] [Structure] Pyromellitic dianhydride and 3,3 ', 4,4'- Benzophenone tetracarboxylic dianhydride was esterified with 2-hydroxy-1,3-dimethacryloxypropane and methanol, and then condensed with 2,2-bis [4- (4-aminophenoxy) -phenyl] propane. A photosensitive resin composition containing a polyamic acid ester as a main component. [Effect] It has good photosensitivity and the cured film is Si. It is possible to obtain a photosensitive polyimide resin which has excellent adhesion to the substrate and the epoxy-based encapsulating material, and which does not deteriorate even after the moisture absorption treatment. |