http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0680863-A

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filingDate 1992-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1994-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0680863-A
titleOfInvention Epoxy resin composition
abstract (57) [Summary] [Objective] To provide an epoxy resin composition having a good molding workability and a small thermal expansion coefficient. [Composition] In a resin composition in which a filler is mixed with an epoxy resin, the filler is fused silica powder obtained by melting quartz powder into a spherical shape, the particle size of which is 100 μm or less, and the particle size distribution is the RRS particle size line. An epoxy resin composition which is a straight line when displayed in the figure, has a gradient n value of 0.6 to 0.95, and has a compounding amount of 80% by weight or more based on the whole.
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