http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0673167-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1992-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 |
| publicationDate | 1994-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0673167-A |
| titleOfInvention | Epoxy resin molding material for encapsulating electronic parts and manufacturing method thereof |
| abstract | (57) [Summary] [Purpose] An epoxy resin molding material for electronic component encapsulation that can be soldered without specific pre-treatment when mounting on a wiring board and does not generate burrs during molding. provide. [Structure] (A) Epoxy resin having two or more epoxy groups in one molecule, (B) Compound having two or more phenolic hydroxyl groups in one molecule, (C) Silane represented by the following general formula coupling agent and (R 1) 3 Si (CH 2) 3 NH (CH 2) n NHR 2 ( wherein, R 1 represents an alkyl group or an alkoxy group having 1 to 6 carbon atoms, R 2 is H, 1 carbon atoms To C6 alkyl group, C2 to C6 alkenyl group, C1 to C6 alkoxy group, C6 to C12 aryl group or substituted aryl group, C6 to C12 aralkyl group or substituted aralkyl group, (n represents an integer of 2 to 8.) (D) An epoxy resin molding material for electronic component encapsulation containing an inorganic filler. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002110721-A |
| priorityDate | 1992-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.