| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
1992-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc623cb47c638cce6085115b86b07a98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97397b725f1998849a3ba9e3709cd1b9 |
| publicationDate |
1994-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0673166-A |
| titleOfInvention |
Epoxy resin molding material for electronic parts encapsulation |
| abstract |
(57) [Summary] [Object] To provide an epoxy resin molding material for electronic component encapsulation, which has excellent high-temperature storage characteristics and is suitably used for VLSI production. [Structure] (A) Epoxy resin having two or more epoxy groups in one molecule, (B) Compound having two or more phenolic hydroxyl groups in one molecule, (C) Brominated naphthol derivative and / or its An epoxy resin molding material for encapsulating electronic parts, which comprises a glycidyl ether compound and (D) an inorganic filler. |
| priorityDate |
1992-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |