http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0665854-U
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N17-00 |
| filingDate | 1993-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1994-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0665854-U |
| titleOfInvention | Solder heat resistance tester |
| abstract | (57) [Summary] [Purpose] Perform heat resistance tests of substrates such as copper clad laminates safely and efficiently. [Structure] A plurality of solder baths 1, 1, ... And a set jig 3 for detachably mounting a substrate 4 such as a copper clad laminate, and moving the substrate 4 up and down to immerse it in the corresponding solder bath 1, 1 ,. And a control unit 5 for instructing the operation of each drive device 2, 2, .... |
| priorityDate | 1993-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 |
Total number of triples: 12.