http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0661627-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ac17835c97e6c72213815ca74845386
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
filingDate 1993-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf525a11f7d7e4f8fab8ded18adb3aed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d9d03ef873192174f47d02513f7a134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7d44f5771e54f96376e19839b0fb71e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6533877ee20e20f9acccead6df3322a1
publicationDate 1994-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0661627-A
titleOfInvention Method for forming solder resist film pattern
abstract (57) [Summary] (Correction) [Purpose] To form a solder resist film pattern having high electrical insulation, heat resistance and chemical resistance with high resolution on the surface of a printed wiring board. [Composition] A step of forming a layer of a negative or positive photosensitive resin composition on the surface of a printed wiring board; a step of irradiating the formed photosensitive resin layer with ultraviolet rays to cure a region where a solder resist film is not formed; A step of removing the uncured region of the photosensitive resin layer; a solder having a surface tension difference of 5 or more with the cured photosensitive resin layer in the region of the surface of the printed wiring board from which the uncured photosensitive resin layer has been removed. It has a step of forming a film of the thermosetting resin composition for resist; a step of curing the thermosetting resin composition by heating; and a step of removing the photosensitive resin layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010100812-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013084816-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001203465-A
priorityDate 1992-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15597427
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420223261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452209933
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3033863
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13140
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419476681
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420166926
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID432083743
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407219005
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3283
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3032390
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414865767
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415822679
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70837
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4139
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419547917
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12545759
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID79130
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7020
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9608
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410438879
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453990377
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90571
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22385448
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID428402223
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID122825
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID154160250
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420258787
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID422760642
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458433298
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13654
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415767689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID91058
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523993
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID54174859
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450513694
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID416224551
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20092305
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523318
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21225906
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID86735221
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID71312293
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410438835
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415747868
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11448
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419528099

Total number of triples: 63.