| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
1993-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08f8582e7ba1984ba65e9cb0b0b12a93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7013d9dbef1ee50950a1f07e3ce5b54d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8305ef2a4d2b7e7db8b08125ba6dcf2 |
| publicationDate |
1994-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0661601-A |
| titleOfInvention |
Metallization layer and method of forming the same |
| abstract |
(57) [Summary] [Object] To provide a metallization layer having improved adhesion between a substrate and a metal. A metallization layer is embedded in the substrate and is adjacent to the metallization layer. Including 20. Adhesion is improved by removing moisture from the surface of the substrate by heating. High adhesion is also obtained by depositing a mixture of metals including chromium and copper. The chromium to copper ratio is initially high and decreases as the deposition process progresses. Completion of the process is determined by approaching the required final ratio of chromium to copper observed by emission spectroscopy. The process can be carried out continuously using a multi-chamber vacuum sputtering system. |
| priorityDate |
1992-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |