| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1991-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0cde397b0dcac87b75e0794ea58eadc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72c7f23ce4ef10ba8309cbfa427d360d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1423748bb175547d598f77309499dc94 |
| publicationDate |
1994-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0661303-A |
| titleOfInvention |
Solder interconnect structure and method of making the same |
| abstract |
(57) [Summary] (Modified) [Objective] To form an interconnect structure for bonding an integrated semiconductor device to a carrier substrate, especially a solder interengagement connection exhibiting improved fatigue life and stability. Concerning the structure of. A gap formed by a solder bond between a carrier substrate and a semiconductor device is a composition obtained by curing a composition containing a cycloaliphatic epoxide and / or a curable cyanate ester or a prepolymer thereof. A filled solder interconnect, wherein the composition has a maximum particle size of 31 microns and is at least substantially free of alpha particle emission. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6756680-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9181440-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6372548-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6664637-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8815725-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6538315-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6955982-B2 |
| priorityDate |
1990-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |