http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0649421-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
filingDate 1992-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b5bd30e7583dfaf4d7ea005d0e3f0e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60482e5ca40a02aa5b4e59af10aa10ef
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publicationDate 1994-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0649421-A
titleOfInvention Method for producing adhesive tape for surface protection
abstract (57) [Summary] [Object] The object of the present invention is to heat-treat in a short time, and when it is applied to the surface of an adherend such as a synthetic resin plate or a metal plate, the adhesive strength is The object of the present invention is to provide a method for producing a pressure-sensitive adhesive tape for surface protection, in which the pressure-sensitive adhesive does not rise and the pressure-sensitive adhesive does not transfer to the surface of the adherend. According to the present invention, a pressure-sensitive adhesive containing a cross-linking agent is applied to one surface of a base film selected from a single-layer film or a multi-layer film, dried, and a pressure-sensitive adhesive layer is provided, followed by dielectric heat treatment. A method for producing a pressure-sensitive adhesive tape for surface protection is provided.
priorityDate 1992-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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