http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0649291-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L31-04
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filingDate 1992-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_877946c4526be4d6b5387803eada073c
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publicationDate 1994-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0649291-A
titleOfInvention Hot melt composition
abstract (57) [Summary] [Purpose] In a hot-melt adhesive containing ethylene-vinyl acetate copolymer as the main component, the melt viscosity is low even if the blending amount of the high-melting wax is reduced, or even if the high-melting wax is not blended. Provided is a hot melt composition having excellent heat resistant adhesion. [Constitution] Two or more ethylene / vinyl acetate copolymers A hot melt composition comprising (A) and (B), (A) has a [VA] of 23 to 45 and [MFR] of 0.1 to 200, and (B) has [VA] is 5 to 22, [MFR] is 10 to 400, and [mp] Is higher than the temperature specified in relation to [MFR] and [VA] (however, [MFR] is the melt flow rate (g / 10min) at 125 ℃ and 325g load, and [VA] is the vinyl acetate content. (Wt%), [mp] is the temperature (° C.) at which the maximum endothermic peak based on the differential scanning calorimeter is shown). Further, a tackifying resin and / or a wax can be further added to the hot melt composition.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018076398-A
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priorityDate 1992-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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