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filingDate 1992-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eca09e0df60950d402e1e5fc824b687
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publicationDate 1994-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0641515-A
titleOfInvention Conductive tape-shaped sealing material and method for manufacturing the same
abstract (57) [Summary] [Purpose] The conventional conductive tape-like sealing material in which a conductive adhesive containing a conductive filler is impregnated into a urethane foam, etc. (EN) Provided is a conductive tape-like sealing material suitable for spot welding and electrodeposition coating, which solves the problem of reduction and the disadvantage that a large amount of expensive conductive filler must be used to impart conductivity. [Structure] An impregnated layer 3 of a conductive adhesive containing a conductive filler is formed on at least the surface layer portion of the conductive porous body 2 which is integrated with a conductive polymer or has been made conductive by electroless plating. Conductive tape sealing material.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4843700-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006324034-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4622669-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006156363-A
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priorityDate 1992-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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