http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0639345-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224
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filingDate 1992-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94a15289bc29c2fbb720a8bdf2fc98f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3a5cae58db6c9c38905cdfb0f81361c
publicationDate 1994-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0639345-A
titleOfInvention Coating method of capacitor surface with epoxy resin
abstract (57) [Summary] [Structure] A homopolymer composed of a polymerizable compound containing a perfluoroalkyl group having 4 to 21 carbon atoms or a polymerizable compound 90 containing a perfluoroalkyl group having 4 to 21 carbon atoms. Any one of copolymers composed of not less than 10% by weight and not more than 10% by weight of a compound copolymerizable therewith is applied to the lead wire of the capacitor so as to include at least the ends, and then the capacitor body and the lead wire. A method for coating the surface of a capacitor with an epoxy resin, which comprises immersing a part or the whole of the coated part in the epoxy resin and finally curing the epoxy resin. [Effect] It is possible to prevent the epoxy resin from adhering to the lead wire at the time of manufacturing the capacitor, and even if it is adhered, the epoxy resin can be easily detached with a fingertip or the like.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010024381-A
priorityDate 1989-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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