| abstract |
(57) [Abstract] [PROBLEMS] To provide a method for providing a conductive end portion 23 on a flexible circuit member. The flexible circuit member has a dielectric layer 19 (eg, polyimide layer) having at least one conductive element 41, 45 (eg, copper). This method uses the dielectric layer 19 And a step of forming an opening (for example by punching) through both the conductive element 41 and a step of providing a conductive layer 75 on the inner surface of the opening (for example by additional plating). A step of providing a plurality of dendritic elements 77 (for example by electroplating) on the surface, and a dielectric layer 1 9 and a part of the conductive elements 41, 45 (for example by punching) are removed, after which the formed dendritic element 77 is formed. And (e.g. palladium) projecting from the conductive end 23 of the flexible circuit member. Thus, the connection between the electric circuit member and the flexible circuit member is remarkably improved. |