http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06350251-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_afea2aa6f1f892c1456cf7d7a8bc0242 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 1993-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71e2ae844e297f61db66643a9240d98e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a8562ad7cf431a5b661cf7f19278ebe |
| publicationDate | 1994-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06350251-A |
| titleOfInvention | Through-hole printed wiring board manufacturing method |
| abstract | (57) [Summary] (Correction) [Purpose] High-density, high-precision, through-hole printed wiring board manufacturing method that does not cause circuit disconnection, circuit loss, etc. and can be manufactured by a simple process. . [Structure] A through-hole 3 is filled with a highly viscous ion-dissociative resin aqueous solution 4, and a photosensitive resist film 5 is formed on the conductive film on the surface of the printed board 1 by electrodeposition coating. Next, the circuit mask pattern 6 is brought into close contact, exposed and developed to form an etching resist film 7 corresponding to the circuit pattern, the conductive film is removed by etching, and the etching resist film 7 and the ion dissociation property in the through hole 3 are removed. The resin aqueous solution 4 is removed. |
| priorityDate | 1993-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.