| abstract |
(57) [Summary] (Correction) [Purpose] To provide a semiconductor wafer inspection / repair device that performs in-line the burn-in inspection process for a large number of semiconductor chips on a semiconductor wafer and the subsequent repair process. . [Structure] Straight transport path 30 for transport unit 300 A loader unit 20 for supplying the semiconductor wafers 1 one by one is provided at one end of the burn-in inspection unit 40, and a burn-in inspection unit 40, a probe inspection unit 50, a laser repair unit 62, a deposition repair unit are provided on both sides of the transfer path 30. 64, marking part 7 0, a baking unit 80, and a visual inspection unit 90 are arranged. In the loader unit 20, the semiconductor wafer 1 taken out from the cassette 22 is pre-aligned on the chuck 28a to detect the ID information attached to the wafer 1. |