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filingDate 1993-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25602ddb5505903ea004b498f7c51d71
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publicationDate 1994-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06322129-A
titleOfInvention Polyimide resin and laminate using the same
abstract (57) [Summary] [Structure] 4,4'-diaminobenzanilide and 4, 4'-diaminodiphenyl ether and N-methyl- 2-Pyrrolidone was charged and dissolved by stirring at room temperature while introducing nitrogen. Then, pyromellitic dianhydride was gradually added to the system and stirred at room temperature to synthesize a polyamic acid solution. The obtained polyamic acid solution was uniformly cast-coated on a rolled copper foil 1 using an applicator and dried to form a polyimide precursor layer 2. This substrate was heated in a drying oven to carry out dehydration ring closure to produce a flexible printed circuit board 3. [Effect] The flexible printed circuit board 3 can be easily etched only with an alkaline aqueous solution and has a linear expansion coefficient of the copper foil 1. Since they are close to each other, curling does not occur in the flexible printed circuit board 3 even if they are laminated directly on the metal foil. Therefore, it is possible to reduce costs in terms of process and equipment, and as a result, it is possible to process at low cost.
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