| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
| filingDate |
1993-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d983894527b61ee5ce8b1b3026cd67ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1654ce92148b37e645be68e58c91d41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c925dcc9c9214c34870ac9011249067f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908 |
| publicationDate |
1994-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06322119-A |
| titleOfInvention |
Low dielectric constant thermosetting resin composition |
| abstract |
(57) [Summary] [Structure] A bismaleimide compound represented by the general formula (1) and / or a prepolymer thereof (a), and a brominated maleimide oligomer (b) having a structural unit represented by the general formula (2). The weight ratio of (a) and (b) is 80/20 to 20/8. A low dielectric constant thermosetting resin composition in the range of 0. [Chemical 1] (R 1 to R 8 represent hydrogen or an alkyl group, which may be the same or different from each other, R 9 represents a divalent aliphatic residue, and has a carbon number of R 1 to R 9 ; The total is 9 or more.) (R and R'represent divalent aliphatic and / or aromatic residues, which may be the same or different from each other.) [Effect] Adhesion to metal with low dielectric constant and low dielectric loss tangent It is possible to obtain a resin composition which is excellent in heat resistance, flame retardancy, heat resistance and chemical resistance, and which is optimum for a printed wiring board which requires a low dielectric constant and a low dielectric loss tangent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014169450-A |
| priorityDate |
1993-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |