http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06322118-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6cfc033f059d282fcd915bc8be2ae53f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1993-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d54c5117f80c5371f86ade68cff2245e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_481cda5415cf0adad1aef82ee06bca77 |
| publicationDate | 1994-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06322118-A |
| titleOfInvention | Resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] [Structure] A polymaleimide compound, an amino compound containing at least one selected from the diguanamines represented by the general formulas (1) and (2), and an inorganic filler, Alternatively, a resin composition for semiconductor encapsulation containing a polyfunctional epoxy compound as an essential component. (In the formula, the bonding position of the (4,6-diamino-1,3,5-triazin-2-yl) group is 2,5-, or 2,6 -Indicates position) (In the formula, the bonding position of the (4,6-diamino-1,3,5-triazin-2-yl) group is 1,2-, 1,3- or 1,4-position) A resin composition having a high glass transition temperature and high strength even at a high temperature can be obtained. It is optimal as a sealing material for semiconductor devices that require solder dipping resistance. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017110051-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018115233-A |
| priorityDate | 1993-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 158.