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filingDate 1991-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7010412f95f5ba3429e8020e899cc1fb
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publicationDate 1994-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06316689-A
titleOfInvention Reactive hot melt adhesive
abstract (57) [Summary] [Purpose] In hot melt adhesives, the temperature is 9 Provided is a polyurethane-based reactive hot-melt adhesive which can be melt-coated at a low temperature of 5 ° C. to 130 ° C. and has a large initial adhesive force and a long bondable time. [Structure] Polyester polyol having a melting point of 40 ° C. or higher and 65 ° C. or lower obtained by a condensation reaction of diol with adipic acid, suberic acid, sebacic acid and diesters thereof, and / or obtained by ring-opening polymerization of lactone ring A lactone polyester polyol having a melting point of 40 ° C. or higher and 65 ° C. or lower is used, and a diol having 10 or less carbon atoms and at least one side chain alkyl group is used as a chain extender, A reactive hot melt adhesive characterized by comprising an isocyanate group-containing prepolymer having an isocyanate group content of 1.5 to 5.5% by weight obtained by reacting the above with an organic isocyanate as a main component.
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