http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06316632-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C261-02 |
| filingDate | 1994-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5160af56de59580667d539f6c65db04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab2ed7e672cd10d1a41ab3237c0a1f79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a35a60e6a121977dc5dac12be76bf1f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0611b4a1774ae47cf95599e7d1df00f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_082769664972dd9b0248dc1d23b72a9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0c7e02b72c9d6a7dc53fe03d64f7d0 |
| publicationDate | 1994-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06316632-A |
| titleOfInvention | Thermosetting resin composition and copper-clad laminate |
| abstract | (57) [Summary] (Modified) [Objective] To provide a thermosetting resin composition having excellent low dielectric properties and water resistance, and heat resistance that can be practically used, and a copper clad laminate. [Structure] (A) The following general formula (1) [In the formula, R and Q each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 5 to 7 carbon atoms, or a cycloalkyl group having 5 to 7 carbon atoms. It represents any of hydrocarbon groups containing 6 to 20 carbon atoms. Further, i and j are independently 0 It takes an integer value of 4 or more. M is the following general formula (2) (In the formula, T is the same as R and Q above. K is 0 or more and 10 The following integer values are taken, and m takes an integer value of 0 or more and 8 or less. ) Is shown. ] The thermosetting resin composition which has the cyanate compound or its prepolymer represented by these, and (B) hardening | curing agent as an essential component, and the copper clad laminated board formed by heat-molding this thermosetting resin composition. |
| priorityDate | 1993-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 216.