http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0631478-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-30 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1992-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74520d19ad13f324037269b44b565ab6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68b62c042785dba6dc51483e0324c1d0 |
| publicationDate | 1994-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0631478-A |
| titleOfInvention | Laser ablation method and manufacturing method of multilayer wiring structure |
| abstract | (57) [Abstract] [Purpose] Regarding the laser ablation processing method and the method for manufacturing a multilayer wiring structure using this processing method, the generation of soot due to the laser ablation processing is suppressed. In a laser ablation processing method in which the organic material film 13 is locally decomposed and removed by irradiating with a laser beam 22, the vicinity of the surface of the organic material film 13 to be processed is shielded from the atmosphere, The hydrogen gas atmosphere is used to cool the plasma generated by the decomposition of the organic material 13 to be processed, thereby suppressing the generation of soot. At this time, at least a part of the structure that shields the vicinity of the surface of the organic material to be processed from the atmosphere is constituted by the dielectric mirror mask 16 in which the dielectric multilayer mirror is selectively formed on the transparent substrate. In addition, via holes for interlayer connection are formed in the interlayer insulating film of the multilayer wiring structure by this laser ablation method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02076666-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7887712-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10508798-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005507318-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4643889-B2 |
| priorityDate | 1992-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.