http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06313775-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
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filingDate 1993-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c5d5b7cba756357b9e95cde457b17dd
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publicationDate 1994-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06313775-A
titleOfInvention Manufacturing method of test contact pin
abstract (57) [Abstract] [Purpose] To realize a highly productive method of manufacturing a contact pin for a test, which is suitable for testing an IC wafer or bare chip. [Structure] A step of forming a first metal layer 11 of a material to be adhered to or bonded to a material of a test contact pin on a substrate layer 10, and a mask 12 on the first metal layer 11. A plating process of forming a second metal layer 14 for a test contact pin on the unmasked portion 12a by plating, and a test contact pin on the second metal layer 14 from which the mask is removed. A deposition step of depositing a film 15 covering a portion other than the portion provided for the step of separating the substrate layer 10 and the first metal layer 11 from the film 15 and the second metal layer 14. Equipped with.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6475822-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010080660-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010080569-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7005751-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7131848-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7195503-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6246247-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008275646-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6483328-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7073254-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6482013-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08220140-A
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Total number of triples: 31.