Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate |
1993-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e47f7876546e3799016799db77a5e55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3e9e2ab09dbc1b9555e31b8ee1d81cf |
publicationDate |
1994-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H06308007-A |
titleOfInvention |
Thermal shock test method for printed wiring boards |
abstract |
(57) [Abstract] [Purpose] To provide a thermal shock test method for a printed wiring board that is easy to match the conditions actually used and is effective for the environment. [Structure] Alcohol and dry ice were used as low-temperature refrigerants, and oil was used for high-temperature treatment in a low-temperature and subsequent high-temperature thermal shock test of the printed wiring board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111948032-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012141208-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104215539-A |
priorityDate |
1993-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |