| abstract |
(57) [Summary] The present invention provides (i) a cupric compound, (ii) diethylenetriaminepentaacetic acid or a salt thereof, (iii) monoethanolamine and N, N, N ', N'-tetrakis ( The present invention provides an electroless copper plating solution comprising an aqueous solution containing at least one of 2-hydroxypropyl) ethylenediamine and (iv) a hydrazine compound. [Effect] The electroless copper plating solution of the present invention uses a hydrazine compound that is odorless and does not accumulate decomposition products as a reducing agent, and has good bath stability and excellent plating depositability. It is possible to stably form a good copper plating film without deteriorating the environment. |