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filingDate 1993-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_812eed9a1163ec4beb04c6ffa00b8ebf
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publicationDate 1994-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06305714-A
titleOfInvention Method for forming ferroelectric film and method for manufacturing capacitor by sol-gel method
abstract (57) [Summary] [Structure] When the PZT ferroelectric film 7 is formed by the sol-gel method, the film thickness is controlled to be 1000 Å, or the drying temperature of the raw material solution is 130 to 2 A method in which the boiling point is specified to be in the range of 00 ° C., and is set lower than the boiling point of the stabilizer contained in the sol-gel raw material and higher than the boiling point of the solvent contained in the sol-gel raw material. [Effect] By carrying out the oxidative sintering treatment at a temperature at which a perovskite crystal is formed, a thin film exhibiting a (100) crystal orientation can be easily formed. In addition, a completely crack-free film can be formed thick.
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