| abstract |
(57) [Summary] [Object] To provide a mold epoxy resin composition and a resin mold that can be cured at room temperature, have a small curing shrinkage, and do not warp. [Structure] Bisphenol type epoxy resin 60 to 80% by weight, glycidyl amine type epoxy resin 20 to 40% by weight An epoxy resin and a bisspirocyclic diamine, 3-aminomethyl-3,5,5-trimethylhexylamine, A mold epoxy resin composition comprising a curing agent comprising one or more curing agents selected from metaxylylenediamine, N-aminoethylpiperazine and polyaminoamide. And a resin type that is a cured product thereof. |