| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
1993-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a5c8be8333be3df695696ac631d2eae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_082769664972dd9b0248dc1d23b72a9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_967852d49d1824ebacfe8d2c7ac336f1 |
| publicationDate |
1994-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06287275-A |
| titleOfInvention |
Thermosetting resin composition and electronic component sealed with the same |
| abstract |
(57) [Abstract] [PROBLEMS] To provide a thermosetting resin composition having excellent adhesiveness, moisture resistance and heat resistance, and an electronic component molded and sealed by the composition. [Structure] (A) Polymaleimide compound having two or more maleimide groups in molecule, (B) Epoxy resin having two or more epoxy groups in molecule, (C) Epoxy resin curing agent and (D) Acid A thermosetting resin composition containing a specific acidic phosphoric acid ester compound such as phosphooxyethyl methacrylate, and an electronic component molded and sealed by the composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006310499-A |
| priorityDate |
1993-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |