| abstract |
(57) [Summary] [Structure] (A) an alkali-soluble resin and (B) a quinonediazide group-containing compound, (C) (a) an alkyl 2-oxylopropionate, and (b) a viscosity at 20 ° C. The positive resist composition is obtained by dissolving in a mixed solvent of an organic solvent of 1 centipoise or less and (c) a hydrocarbon-based organic solvent which is optionally used. [Effect] A positive resist composition having excellent coating properties, storage stability, step coverage, and safety, which is suitable for use in manufacturing electronic component materials. |