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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56
filingDate 1993-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8465b00c5d990dd355c23e9e2317f872
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c94a8dc6949a75a6aa7b158df179f07b
publicationDate 1994-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06271651-A
titleOfInvention Epoxy resin composition
abstract (57) [Summary] [PROBLEMS] To provide an epoxy resin composition which can be cured at a relatively low temperature in a short time, has a small temperature dependence of the properties of the cured product, and has a large breaking strain to give a toughened product. [Structure] A, the weight ratio of 100 parts by weight of epoxy resin B, triamine consisting of only three secondary amine moieties in the molecule and diamine consisting of only two secondary amine moieties in the molecule is 1:15 to 1 : 60 to 400 parts by weight of a precondensate of an aromatic secondary amine and an epoxy resin of 0.6, at least one curing agent D selected from dicyandiamide and its derivative or an organic acid hydrazide compound, and curing acceleration An epoxy resin composition containing an agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001342324-A
priorityDate 1993-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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