| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
1993-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b9f8d5260ab980ad1a17f3cbe15ec9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc623cb47c638cce6085115b86b07a98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 |
| publicationDate |
1994-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06271647-A |
| titleOfInvention |
Epoxy resin molding material for electronic parts encapsulation |
| abstract |
(57) [Summary] [Purpose] To provide an epoxy resin molding material for electronic component encapsulation which has no bleed-out during molding and is excellent in thermal shock resistance and reflow crack resistance. [Structure] Structural formula (A) as the main component is An essential component is a melt mixture of an epoxy resin represented by (1) and (B) a compound having two or more phenolic hydroxyl groups in one molecule and 1,2-polybutadiene having epoxy groups at both ends. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001031941-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019035032-A |
| priorityDate |
1993-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |