http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0626244-U
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-028 |
| filingDate | 1992-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1994-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0626244-U |
| titleOfInvention | Solid electrolytic capacitor |
| abstract | (57) [Summary] [Purpose] To provide a solid electrolytic capacitor using an organic semiconductor as a solid electrolyte, which eliminates soldering defects when mounted on a printed circuit board. [Structure] The capacitor element 3 is preheated in advance in TCN. A certain amount of a heat-melted organic semiconductor made of Q complex is put into a case 5 having an opening 4 at the tip of the projections and recesses, the organic semiconductor is impregnated into the capacitor element 3, and the opening of the case 5 is sealed with a sealing resin. 7 is filled up to the end surface of the concave portion of the concave-convex shape of the opening end, and the opening of the case 5 is sealed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3835071-C2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3835071-A1 |
| priorityDate | 1992-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454641732 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID167786 |
Total number of triples: 15.