http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06258833-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 1993-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef0cacd9d4c8c83934baf8653b0a6ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f6fd73333c52530dd0b90822965895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_560517ae58af2b9362dc3d75f8333ae2 |
| publicationDate | 1994-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06258833-A |
| titleOfInvention | Heat-resistant photosensitive resin composition |
| abstract | (57) [Summary] [Object] To provide a heat-resistant photosensitive resin composition having both excellent photosensitivity and good film properties. [Structure] (A) General formula (I) (In the formula, X and Y represent a dimerizable or polymerizable group, R 1 represents a (2 + p) -valent organic group, R 2 represents a tetravalent organic group, and p represents an integer of 1 or 2. One of the two COO-Y bound to R 2 is bonded to adjacent atoms of the atoms bonded to the amide group of one of the R 2, Another COO- Y is bonded to the atom adjacent to the atom bonded to the remaining amide group), and the heat-resistant photosensitive resin composition containing a polyamic acid ester having a repeating unit represented by the following formula. |
| priorityDate | 1993-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 177.