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filingDate 1993-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06c2a67fb99e7382117013c02604c37c
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publicationDate 1994-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06252274-A
titleOfInvention Method of making electronic circuit
abstract (57) [Abstract] [Purpose] To provide optimum oxidation conditions when forming an oxide film on the surface of a metal wiring used in an electronic circuit by anodic oxidation. [Structure] When anodizing a metal wiring such as aluminum, tantalum, titanium, etc., the temperature of the solvent is cooled to 10 ° C. or lower, preferably 0 ° C. or lower, and the anodic oxidation is performed to obtain a uniform surface oxidation rate. Therefore, it is possible to obtain a material which has little unevenness and is most suitable for the purpose of electronic circuit wiring.
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