http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06250403-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 1993-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2ae679c20430c7773ce5e99641e00a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7589647ab27e72992c72b0b978f3722 |
| publicationDate | 1994-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06250403-A |
| titleOfInvention | Water-soluble resist stripping method |
| abstract | (57) [Abstract] [Purpose] To provide a method for stripping a water-soluble resist, which is excellent in suppressing the melting of solder and at the same time being excellent in preventing the precipitation of lead. [Structure] On a substrate laminated with copper foil, a plating resist is formed with a water-soluble resist, solder plating is performed, and then the water-soluble resist is peeled off. Furthermore, at least one of aminoguanidine, hydrazines, sulfurous acid, dithionous acid or a salt thereof, borohydride, carbazic acid ester, thiourea dioxide, sulfinic acids, sulfoxy acids, hydrazides, and semicarbazide salts. Including. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03038529-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7291517-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012021151-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100338530-C |
| priorityDate | 1993-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.