http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06244520-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate | 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622 |
| publicationDate | 1994-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06244520-A |
| titleOfInvention | Flexible printed circuit board |
| abstract | (57) [Abstract] (Modified) [Purpose] To improve the adhesion by jumper circuit, through-hole circuit, and electromagnetic wave shield to the circuit pattern to improve conductivity and flex resistance. [Structure] Circuit pattern 1 contains lead and tin, tin and antimony, or lead and antimony, and the total content of both is 0.02 to 0.15% by weight, and the content of each is 0. 0.006% by weight or more, oxygen content 0.0001 to 0.005 It is formed by a copper alloy rolling annealed foil of weight%. The electromagnetic wave shield 7 and the jumper circuit 6 are 100 parts by weight of metallic copper powder whose surface is coated with 0.05 to 0.2 parts by weight of titanate. Resol type phenolic resin 5 to 30 parts by weight, chelate layer forming agent 0.5 to 4 parts by weight, adhesion improver 0.1 to 5 parts by weight, It is formed of a conductive paint containing 0.5 to 7 parts by weight of a conductivity improver. The through-hole circuits 5a and 5b are 100 parts by weight of metallic copper powder surface-coated with the titanate, 5 to 33 parts by weight of a resol type phenol resin having a specific relationship, 0.5 to 3.5 parts by weight of an amino compound, and a chelate. It is formed of a conductive coating material containing 3.0 to 10 parts by weight of a layer forming agent. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114025471-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010192731-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008069035-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003086907-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5171641-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8754324-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008069035-A1 |
| priorityDate | 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.