| abstract |
(57) [Summary] [Purpose] To give a cured product having good storage stability and fluidity, and excellent properties such as curability, moisture resistance, and adhesiveness. An epoxy resin composition suitable as a resin for semiconductor encapsulation is obtained. [Structure] (1) Epoxy resin having two or more epoxy groups in one molecule, (2) Non-novolak type phenol resin containing two or more phenolic hydroxyl groups in one molecule, and tetraphenylphosphonium tetraphenyl A curing agent obtained by heating and mixing borate with the above-mentioned softening point of the non-novolak phenolic resin, (3) Add an inorganic filler. |