http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0622252-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 1988-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1994-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0622252-B2 |
| titleOfInvention | Gold plating method for electronic components for semiconductor integrated circuits |
| priorityDate | 1988-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.