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filingDate 1993-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2e27bcde129048a861570d3001df6b9
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publicationDate 1994-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06220685-A
titleOfInvention Insulator plating method and printed wiring board plated thereby
abstract (57) [Summary] [Structure] After coating a pre-plating insulator with a conductive polymer compound doped with a compound having two or more anion groups per molecule and a halogen ion, Perform electroplating. [Effects] According to the present invention, electroplating with greatly improved reliability can be realized at a high plating speed even for through-hole plating and the like, which require high accuracy and reliability.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09116256-A
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priorityDate 1993-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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