| abstract |
(57) [Summary] [Structure] 1. (A) Polyphenylene sulfide resin 20 to 70% by weight, (B) 70 to 30% by weight of a polyphenylene ether resin modified with maleic anhydride, (C) 1 to 10% by weight of conductive carbon, (D) an organic silane compound such as 2% by weight or less of epoxysilane, and (E) a thermoplastic elastomer such as hydrogenated (styrene-butadiene-styrene) block copolymer 3. ~ 1 A conductive resin composition comprising 5% by weight of (F) an inorganic filler having a plate-like particle shape, for example, 5 to 20% by weight of mica. 2. An electronic component storage container molded from the composition. [Effect] In addition to excellent heat resistance, moldability and toughness, it also has small warpage and excellent dimensional stability. |